Patent applications related to cloud decreased by 34% per year on average in the packaging industry since 2020

The global packaging industry experienced a 34% decline in annual average growth rate (AAGR) in the number of cloud-related patent applications between 2020 and 2022. The total number of cloud-related grants decreased by an AAGR of 20% during the same period, according to GlobalData's patent analytics database.  

Notably, the number of cloud-related patent applications in the packaging industry was 98 since 2020, while 144 applications were granted.  

Analysis of patent applications by company shows that Avery Dennison and Tetra Laval International filed the most cloud patents within the packaging industry since 2020. The companies filed five cloud-related patents each, since 2020.  

They were followed by Viatris (four applications), Freudenberg (three applications), and CCL Industries (three applications).  

[graph title] Top five companies by patent applications related to cloud in the global packaging industry, 2020-2022  

Analysis of patent grants by companies shows that Viatris was granted 13 patents related to cloud within the packaging industry since 2020. It was followed by Sca Ipla (four grants), and Avery Dennison, Lantech.Com and Melitta Single Portions, with three grants each.

The largest share of cloud-related patent publications in the packaging industry since 2020 was held by China with 48%, followed by South Korea (11%) and the US (6%).

GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData’s Patents Analytics tracks patent filings and grants from official patent offices around the world. Proprietary analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries